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Multi-wave Soldering System Multi-process

Multi-wave Soldering System Multi-process

Lead-free Selective Multi-Wave Soldering Machine With the high precision and reliable making process, th soldering quality of the machine is beyond than the traditional wave soldering under some conditions. Lead-free Selective Multi-Wave Soldering Machine With the high precision and reliable...

Lead-free Selective Multi-Wave Soldering Machine

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With the high precision and reliable making process, th soldering quality of the machine is beyond than the traditional wave soldering under some conditions.


Four Advantages
● Greatly improved the soldering quality and guaranty the consistency and reliable soldering quality to avoid the manual soldering defects.
● Fully solve the problem of the low efficiency of selective soldering improved the production growth more than ten times.
● Greatly save the number of soldering workers and improved the company production efficiency and benefits.
● Fully solve the soldering difficult that the traditional wave soldering can not solve.


Features

The spray system adopts X-Y platform +stepper motor drive, which can be selectively spraying and effectively save the flux.

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With the independent temperature control and using cesium heating lamp, the machine can significantly improve the thermal efficiency and temperature uniformity.

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The position of the PCB allows a high accuracy and reliability, which is controlled by the clamping device from the cylinder of X-Y-Z direction.

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The lifting of solder pot is adopted with the high precision ball screw rod and stepper motor control, which features the high position accuracy and quantifiable precise control.

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The soldering nozzle is adopted with the full Ti-alloy materal and high precision processing to ensure the stable performance. It totallymeets the soldering requirements from the PCB (bottom spaces max.50mm) and breaks throughout the process limits of traditional wave soldering and selective soldering.

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Specifications

Requirements and Specifications


Items

Specification

Remark

SGS-350

 

 

Min.PCB size

50(W)X120(L) mm

including the fixtures

Max.PCB size

450(W)X450(L)mm

including the fixtures

PCB weight

Max. 8 KG

including the fixtures

PCB upper space

100mm

 

PCB lower Space

50mm

 

PCB process edge

≥4mm

 

Machine weight

≤2000Kg

 

Body

 


Structure

three segment

available to splitting and combining

Machine dimension

L5223×W1353×H1720 mm


Board Handling

 

 

PCB conveyor height

750±50 mm

 

PCB conveyor speed

0.5~10 m/min

Electronic-control

PCB conveyor direction

L-R OR R-L

 

Conveyor stable

No jumping and shaking phenomenon

 

Conveyor resolution

0.05mm/s

Encoder Frequency Max.1KHz

Conveyor alarm

Real-time alarm card board, plate alarm

 

Width adjustments

Motorized

 

Fluxer Spray

 

 

Spraying height

70~100 mm

 

Spraying travel

450x450 mm

 

Spraying platform

XY table+stepper system

programmable

Spraying nozzle movement speed

Max. 500mm/s

Stepper motor

Re-position accuracy

±0.25 mm

 

Spraying uniformity

±3% or better

 

Spraying accuracy

±1% or better

 

Nozzle self-cleaning

compression air cleaning

 

Exhaust

No flux on the surface

No flux for 8 hours working

Maintenance range

> 1 week

 

Flux Flow

10~200ml/min

flow meter control

Flux buffer capacity

2 L

available to have the external container

Air pressure

0.4 Mpa

 

Air consumption

7m³/H

 

Flow accuracy

±3ml

According to different kind of flux

programming method

Teach programming


Preheater

 

 

Preheating

Max. 180℃ (PCB bottom surface)


Preheating

Max. 150℃ (PCB upper surface)


Temp. setting

Max. 300℃

 

Temp. control

±2℃ @3 sigma

 

PCB heating uniformity

5℃ @3 sigma

Standard board

Heating method

IR –heating


Heating power

9*2KW

 

Heating

Hot air

Option :1.8m, 3 independent preheating zone

Solder

 

 

Solder capacity

200~400KG


Temp. Control

±1℃ @ 3 sigma/Cpk≥1.33

 

Max.temperature

300℃ (Highest 300℃)


280℃(highest used temperature 280℃)

 

Heating power

6*1.6KW

 

soldering wave heights

0~4mm

 

Tin wave smoothness

±0.1s @ 3 sigma

 

Solder pot in/out

Motorized


Solder up /down

stepper control system

 

Solder up/down travel

50 mm

 

Solder wave driving

High precision motor

 frequency converter control

Solder melting time

<3 hr


Solder pot

Ti- alloy

 

Soldering nozzle

customized


PCB position

XYZ axis air cylinder clamping

 

Control System

 

 

Power supply

3P5W 380V, 50/60Hz

 

Power

35 KVA

Max.Power

withstand voltage

1500V 5S

 

Grounded resistance

<1 Ohm

 

Insulation resistance

> 25 Mohm

 

connector

Front and back power plug

 

Safety Compliance

 

 

components

CE

 

Electrical wire

CE/UL

Waterproof/fire/high temperature corrosion resistance

Machine

CE (LVD/EMC/MD)

 


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